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Square FBGA-900 FPGA chip with grid of solder balls

YINGHUA

YINGHUA XC7K410T-2FFG900I FPGA-Field Programmable Array FBGA-900 semiconductor

SKU CH-HPB2-VB4HZ

A 410K-gate field-programmable gate array in a 900-ball FBGA package for custom logic acceleration

  • Product typeICs Semicoductors
  • High-density logic with 410 K equivalent gates
  • FBGA-900 package enables compact board layouts
  • Industrial temperature grade for rugged environments
  • Field-programmable architecture supports rapid design iteration

XC7K410T-2FFG900I FPGA for custom logic design

The XC7K410T-2FFG900I is a field-programmable gate array supplied in a 900-ball FBGA package. It provides 410K logic cells for engineers building custom digital circuits in telecommunications, industrial control or signal-processing applications. The device is new and ready for prototype or production assembly.

FBGA-900 footprint requires matching PCB layout

Integration demands a board designed for the 900-ball FBGA footprint with appropriate power sequencing and configuration memory. The programmable fabric replaces multiple fixed-function ICs, freeing board space and reducing component count. Designers must supply external voltage rails and a bitstream source; no on-board configuration storage is included.

How it compares

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Price $569.99
Pricier than about 91% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What logic density does the XC7K410T provide for sustained compute workloads?

The device integrates 410 K logic cells in a single FPGA fabric, giving a fixed upper bound on parallel resources during continuous operation.

How much heat must the cooling solution handle when the FBGA-900 package runs at full utilisation?

The 900-ball FBGA package concentrates the entire 410 K-cell die, so thermal design must dissipate the full dynamic power of that logic density under sustained load.

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