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Small square black chip with grid of 256 pins

YINGHUA

YINGHUA XC6SLX9-2FTG256I FPGA semiconductor

SKU CH-4YXN-TVRTT

Field-programmable gate array in a 256-ball FBGA package for custom logic designs

  • Product typeICs Semicoductors
  • FPGA provides reconfigurable logic for custom hardware acceleration
  • Field Programmable Gate Array architecture enables post-manufacture design changes
  • FBGA-256 package delivers 256 pins for high-density integration
  • New condition ensures full specification compliance and reliability

XC6SLX9-2FTG256I FPGA for custom logic

The XC6SLX9-2FTG256I is a field-programmable gate array in an FBGA-256 package. It provides reconfigurable logic resources for engineers building custom digital circuits. Designers use it for signal processing, protocol bridging or control functions in embedded systems. The device suits prototyping and low-to-mid volume production where hardware flexibility matters.

Replaces fixed-function ASICs or CPLDs

This FPGA replaces application-specific integrated circuits when design changes are likely or volumes do not justify mask costs. It also supersedes complex programmable logic devices when more logic cells, block RAM or DSP slices are required. The jump is worth it when reconfigurability shortens development cycles or enables field upgrades. Buyers needing hardened processor cores or high-speed transceivers should evaluate other families.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $353.99
Pricier than about 90% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

What PCB footprint and pin count does the FBGA-256 package of the XC6SLX9-2FTG256I require?

The FBGA-256 package uses a 256-ball grid array; design the board with a matching 256-pad footprint and the correct ball pitch for this device.

Which orientation and soldering step is most often missed when hand-placing this FPGA?

Align the package notch or dot with the PCB silkscreen marker, then reflow using the manufacturer’s recommended thermal profile to avoid cold joints on the 256 balls.

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