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Square black TQFP-144 chip with gull-wing leads on four sides

YINGHUA

YINGHUA XC6SLX9-2TQG144I FPGA semiconductor TQFP-144

SKU CH-KVZC-07R85

A field-programmable gate array in a 144-pin TQFP package for custom logic designs

  • Product typeICs Semicoductors
  • FPGA enables custom logic design
  • 144-pin TQFP package suits compact boards
  • New condition ensures reliable operation
  • Spartan-6 architecture supports flexible integration

Spartan-6 FPGA in 144-pin TQFP

The XC6SLX9-2TQG144I is a field-programmable gate array from the Spartan-6 family packaged in a 144-pin thin quad flat pack. It provides reconfigurable logic for custom digital designs in embedded systems, industrial control or signal-processing applications. Engineers and developers use it to implement proprietary algorithms or glue logic without committing to a fixed ASIC. The device is supplied new and ready for prototype or production assembly.

Industrial-grade temperature range

The part is rated for industrial operating temperatures, allowing deployment in environments that exceed commercial limits. Its lead-free TQFP-144 package complies with RoHS assembly requirements and suits standard surface-mount processes. No development software or programming cable is included; users must obtain the vendor toolchain and a compatible JTAG programmer separately. The bare device suits teams that already have the supporting tool flow in place.

How it compares

Measured against everything we stock in Encoders & Semiconductor Parts, at today’s prices. Recalculated every night.

Price $316.99
Pricier than about 90% of the 1,027 comparable items (median $34.99).

Specifications

Product
Product typeICs Semicoductors

Questions about this item

Does the 144-pin TQFP package require any special reflow profile or socket replacement over time?

The device uses a standard 144-pin TQFP surface-mount package; it has no moving parts or consumable components, so no scheduled maintenance or socket replacement is needed.

What thermal or power limit appears first when the FPGA runs at high utilisation for long periods?

Sustained high utilisation raises junction temperature; the practical limit is the package's ability to dissipate heat through the PCB and any attached heatsink before timing margins degrade.

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