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Black cylindrical desktop workstation with glossy finish

Apple

Apple Mac Pro Late 2013 2.7GHz 12-core 64GB DDR3 1TB Flash Dual AMD FirePro D500 desktop PC

SKU CH-87KW-S1X9Y

A 2013 Mac Pro desktop with a 2.7 GHz 12-core Xeon processor, 64 GB DDR3 ECC memory, 1 TB flash storage and dual FirePro D500 GPUs

  • Screen sizeNo Screen
  • ProcessorIntel Xeon
  • Memory size64 GB (4 × 16 GB) of 1866 MHz DDR3 ECC
  • Storage drive1 TB PCIe-based flash storage (macOS)
  • GraphicsAMD FirePro D500
  • CPU2.7 GHz 12-core with 30 MB of L3 cache
  • 12-core Xeon handles heavy workloads with 2.7 GHz clock and 30 MB L3 cache
  • 64 GB DDR3 ECC memory in four 16 GB modules runs at 1866 MHz
  • 1 TB PCIe flash storage boots macOS 10.9 Mavericks quickly
  • Dual AMD FirePro D500 GPUs each provide 3 GB GDDR5 VRAM for graphics
  • Late 2013 Mac Pro cylinder design packs workstation power in compact black desktop

Workstation with dual FirePro D500

This Apple Mac Pro Late 2013 is a cylinder-form desktop workstation built around a single 2.7 GHz 12-core Intel Xeon processor. It ships with 64 GB of 1866 MHz DDR3 ECC memory installed as four 16 GB modules. Storage is provided by a 1 TB PCIe-based flash drive running OS X 10.9 Mavericks. Dual AMD FirePro D500 GPUs each bring 3 GB of GDDR5 VRAM for multi-display and compute workloads.

Who this suits and who should look elsewhere

The 12-core Xeon and dual workstation GPUs suit professionals running macOS-native creative applications that scale across many threads and use OpenCL acceleration. Buyers who need more internal storage capacity or user-accessible drive bays will not find them in this sealed enclosure. Shops requiring Windows-only ISV certifications or newer macOS releases beyond what the hardware supports should evaluate alternative platforms.

Deciding specification — 12-core Xeon

The defining specification is the combination of a 2.7 GHz 12-core Xeon E5-2697v2 with 30 MB L3 cache and dual FirePro D500 GPUs each equipped with 3 GB GDDR5. This fixed CPU-GPU pairing determines whether the system can meet the parallel compute and memory bandwidth demands of the intended workload. No other component can be upgraded to change that balance.

How it compares

Measured against everything we stock in Tower & Compact Desktop PCs, at today’s prices. Recalculated every night.

Price $361.99
Cheaper than about 62% of the 14,711 comparable items (median $494.99).
Memory size 64 GB (4 × 16 GB) of 1866 MHz DDR3 ECC
Higher than about 91% of the 5,840 comparable items (median 16 GB).
RAM capacity 64 GB DDR3
Higher than about 90% of the 13,125 comparable items (median 16 GB).

Specifications

Product
Brand nameApple
Product lineMac Pro
Model nameLate 2013 Mac Pro
Part numberFD878LL/A-CTO
Product typeBusiness Desktops & Workstations
Recommended useOthers
Product colorBlack
Processor
ProcessorIntel Xeon
CPU2.7 GHz 12-core with 30 MB of L3 cache
CPU model2.7 GHz
Processor cache30 MB L3
Memory
Memory size64 GB (4 × 16 GB) of 1866 MHz DDR3 ECC
RAM capacity64 GB DDR3
Storage
Storage drive1 TB PCIe-based flash storage (macOS)
SSD storage1 TB
Hard driveNo
Display
Screen sizeNo Screen
Graphics
GraphicsAMD FirePro D500
GPUDual AMD FirePro D500 GPUs with 3 GB of GDDR5 VRAM each
Size & build
Form factorDesktop
Software
Operating systemOS X 10.9 Mavericks

Questions about this item

How do I install the four 16GB 1866MHz DDR3 ECC modules in the Late 2013 Mac Pro?

Power off the Mac Pro, slide the outer enclosure up to expose the memory tray, release the tray latch, insert each 16GB module into a slot until it clicks, reseat the tray, close the enclosure, then power on to verify 64GB is recognised.

What maintenance or replacement will the dual AMD FirePro D500 GPUs with 3GB GDDR5 VRAM each need later?

The GPUs are soldered to the main board and cannot be swapped; keep the thermal zone clean, monitor fan speed under heavy OpenCL loads, and plan for a logic-board service if a GPU fails.

What limit appears first when the 2.7GHz 12-core Xeon E5-2697v2 runs sustained workloads?

The single 30MB L3 cache and shared thermal envelope cause the processor to throttle before the 64GB DDR3 ECC or 1TB PCIe flash become bottlenecks.

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