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A low-temperature Sn42/Bi58 solder paste with 138 °C melting point, 10 cc no-clean flux and desolder wick for SMD rework on heat-sensitive boards
The Essmetuin RMA799 kit bundles Sn42/Bi58 solder paste with a 138 °C melting point, a 10 cc no-clean flux and desoldering wick. It targets technicians who rework SMD and SMT components on heat-sensitive boards such as paper-phenolic or flexible substrates. The low peak temperature reduces the risk of board damage during component removal and replacement. All three consumables are lead-free and halogen-free.
This kit suits engineers and hobbyists who regularly desolder and replace small parts on low-temperature substrates. The included wick leaves minimal residue, cutting clean-up time after rework. Buyers who need high-temperature alloys for power electronics or automotive modules should look elsewhere, as the Sn42/Bi58 composition is formulated specifically for 138 °C peak profiles.
The Sn42/Bi58 paste melts at 138 °C (280.4 °F), a figure that dictates whether the kit matches the thermal budget of the assembly. If the board or components cannot survive standard SAC reflow temperatures, this alloy enables rework without substrate degradation. Verify the 138 °C limit against the board specification before purchasing.
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| Compatibility | |
|---|---|
| Fit and compatibility | XG-Sn42Bi57.6Ag0.4, ZB402 |
The paste melts at 138 °C (280.4 °F) and is intended for paper boards or soft boards that cannot withstand high temperatures, making it suitable for small-component welding on heat-sensitive substrates.
Apply a thin layer of flux to the pads first, then deposit paste; the step often missed is pre-fluxing the pads so the paste wets evenly and the low-temperature alloy flows at 138 °C without bridging.
Replace the wick once it becomes saturated with solder and no longer draws fresh alloy cleanly; each use leaves only a small residue, so lifespan depends on the volume of joints you desolder.
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