ASRock Rack ROMED8-2T/BCM server motherboard SP3 LGA 4094 8 DDR4 3200 10GbE
- EPYC
- Supports AMD EPYC 7…
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Dual-socket server board with sixteen DDR3 slots, fourteen SATA ports and quad gigabit LAN
The Intel S2600CP4 is a dual-socket SSI EEB motherboard built for Intel Xeon E5-2600 processors. It provides sixteen 240-pin DDR3 slots supporting memory speeds up to 1600 MT/s and a maximum capacity of 512 GB. The platform targets compute-dense workloads such as virtualisation hosts, render farms or high-throughput storage nodes. Builders needing a single-socket layout or newer memory standards should look elsewhere.
The board is rated for processors with a maximum TDP of 135 W each, so a pair of high-wattage CPUs will demand substantial airflow. No active cooling is included; the bare PCB relies on chassis fans directed across the socket area and voltage-regulator zones. Four onboard 1 GbE ports and integrated graphics add minimal heat, but sustained all-core loads will push system power draw toward the upper design limits. Acoustic profile depends entirely on the enclosure and fan curves chosen by the integrator.
One PCI Express 3.0 x16 slot and five x8 slots give room for RAID controllers, NICs or GPU accelerators in a full-height chassis. Fourteen SATA ports support dense drive arrays without extra HBAs, while four USB 2.0 headers and a single COM port cover basic peripheral and console needs. The SSI EEB form factor requires a compatible rack or tower case with matching mounting holes and I/O shield cut-out. An IPMI 2.0 BMC with dedicated LAN enables remote management independent of the operating system.
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No published specifications for this item yet.
Seat both Xeon processors in the two LGA 2011 sockets, apply thermal paste, attach the heatsinks, then populate all 16 DDR3 240-pin slots with DDR3 1600 modules; the step most builders miss is enabling the memory-node interleaving in the BIOS so the 512 GB maximum is recognised across both sockets.
The CMOS battery on the board and the cooling fans attached to the CPU headers typically wear out first; the IPMI 2.0 BMC firmware should also be updated periodically, but no other user-replaceable parts are identified in the specifications.
The platform is rated for a maximum TDP of 135 W per processor, so sustained workloads that push both Xeon E5-2600 CPUs to that envelope will hit the thermal ceiling before any other onboard limit is reached.
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