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SAMSUNG

SAMSUNG 970 PRO MZ-V7P512E 512GB internal SSD

SKU CH-4BG8-ANFEF MPN MZ-V7P512E

M.2 2280 NVMe drive with 512GB V-NAND 2-bit MLC, PCIe Gen 3.0 x4, sequential speeds up to 3500/2300 MBps and 370K/500K IOPS random performance

  • Total capacity512 GB
  • Sequential read speedUp to 3,500 MB/s
  • Sequential write speedUp to 2,300 MB/s
  • Interface typePCIe Gen 3.0 x4, NVMe 1.3
  • Form factorM.2 2280
  • Product typeInternal Solid State Drive (SSD)
  • Sequential reads up to 3500 MB/s accelerate large-file workflows
  • Sequential writes up to 2300 MB/s sustain heavy write workloads
  • Random reads reach 370000 IOPS for responsive multitasking
  • Random writes hit 500000 IOPS to handle bursty I/O
  • Phoenix controller with 512MB DDR4 cache delivers consistent low-latency performance

Samsung 970 PRO 512GB NVMe SSD

The Samsung 970 PRO MZ-V7P512E is a 512GB internal solid state drive using the M.2 2280 form factor. It connects via a PCIe Gen 3.0 x4 interface with NVMe 1.3 protocol. The drive employs V-NAND 2-bit MLC memory and a Samsung Phoenix controller with 512MB of Low Power DDR4 SDRAM cache.

Suited for heavy client workloads not server use

This drive is designed for high-performance client PC applications and engineering workloads requiring fast sequential and random access. The supplier notes it is not designed for server or data centre applications and warranty does not support such usage. Buyers building enterprise arrays should look at drives rated for those environments.

Sequential read up to 3500 MBps

The maximum sequential read speed is rated at 3500 MBps with sequential write up to 2300 MBps. Random read reaches 370,000 IOPS at QD32 and random write reaches 500,000 IOPS at QD32. These figures determine whether the drive meets the throughput needs of the intended workload.

How it compares

Measured against everything we stock in Internal NVMe & SATA SSDs, at today’s prices. Recalculated every night.

Price $140.99
Cheaper than about 61% of the 1,994 comparable items (median $180.49).
Total capacity 512 GB
Lower than about 60% of the 1,368 comparable items (median 1 TB).
Sequential read speed Up to 3,500 MB/s
Higher than about 60% of the 1,180 comparable items (median 2,400 MB/s).
Price per TB $275.37 per TB
Pricier than about 73% of the 1,362 comparable items (median $165.50 per TB).

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Specifications

Product
Brand nameSAMSUNG
Product line970 PRO
Model nameMZ-V7P512E
Total capacity512 GB
Product typeInternal Solid State Drive (SSD)
Intended useConsumer
Performance
Sequential read speedUp to 3,500 MB/s
Sequential write speedUp to 2,300 MB/s
Random read (4K)QD32: 370,000 IOPS
QD1: 15,000 IOPS
Random write (4K)QD32: 500,000 IOPS
QD1: 55,000 IOPS
Storage
NAND flash typeV-NAND 2-bit MLC
Controller chipSamsung Phoenix
Cache memory512 MB Low Power DDR4 SDRAM
Ports & slots
Interface typePCIe Gen 3.0 x4, NVMe 1.3
Power
Idle power draw30 mW (max)
Active power drawAverage: 5.2 W / Maximum: 8.5 W (Burst mode)
Size & build
Form factorM.2 2280
Overall height2.38 mm
Overall width22.15 mm
Product depth80.15 mm
Product weight8g
Shipping weight0.08 kg
Package size175 × 102 × 25 mm
Environment & compliance
Operating temperature range0 °C to 70 °C
Max shock tolerance1,500G & 0.5 ms (Half sine)
More details
Mean time between failures1,500,000 h

Questions about this item

Does the 970 PRO MZ-V7P512E come with a heatsink or mounting screw, or do I need to buy them separately?

The drive is supplied in a plain white box containing only the M.2 2280 module. A motherboard mounting screw and any heatsink must be sourced separately.

I see only the 512GB model listed; how do I decide if this capacity suits my workload?

At 512GB the drive delivers up to 3500 MBps sequential read and 2300 MBps sequential write with 512MB DDR4 cache, making it suitable for heavy client workloads and engineering applications.

What does the 3500 MBps sequential read figure mean once the SSD is installed in my PC?

It represents the peak throughput over the PCIe Gen 3.0 x4 link when reading large contiguous files; real-world speed depends on motherboard lane allocation, thermal conditions and the workload mix.

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