Rosewill RASA-11001 RSV-Cage 4 x 3.5" HDD add-on module server accessory
- Rackmount
- HDD tray: 4 × 3.5 i…
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A 1U passive heat sink for AMD EPYC 7000 series CPUs in OLGA4094 socket, rated up to 180 W TDP
The Supermicro SNK-P0062P is a 1U passive CPU heat sink designed for AMD EPYC 7000 series processors. It supports the OLGA4094 socket, also known as Socket SP3, and handles thermal design power ratings up to 180 watts. The unit is certified by Supermicro for use in single-processor and dual-processor server configurations.
Installation uses the standard SP3 retention frame clips, so no separate backplate or tools are required. The passive design means there are no fan cables to route or power connectors to occupy. Clearance is tight in 1U chassis, so verify that memory modules and voltage-regulator heatsinks do not contact the fins before securing the clips.
Confirm the server chassis provides sufficient front-to-rear airflow for passive cooling at the intended CPU thermal rating. The heat sink is rated for processors up to 180 watts; exceeding this limit will cause throttling. Ensure the motherboard layout matches the SP3 keep-out zone so the sink sits flat on the integrated heat spreader.
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| Product | |
|---|---|
| Brand name | SUPERMICRO |
| Model name | SNK-P0062P |
| Product type | Other |
| Size & build | |
| Shipping weight | 0.45 kg |
| Package size | 152 × 127 × 51 mm |
Monitor CPU temperatures under load; the heat sink supports up to 180 W TDP on Socket OLGA4094, so thermals should stay within the processor's specified limits.
The package includes the 1U passive heat sink certified for Supermicro systems; mounting hardware and thermal paste are typically supplied with the motherboard or chassis, not with the heat sink itself.
The SNK-P0062P is validated for both uni-processor and dual-processor configurations with AMD EPYC 7000 series CPUs up to 180 W TDP; order one unit per populated socket.
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