Rosewill RASA-11001 RSV-Cage 4 x 3.5" HDD add-on module server accessory
- Rackmount
- HDD tray: 4 × 3.5 i…
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Passive 1U CPU heat sink for Xeon Scalable processors using the LGA 3647-0 narrow mounting mechanism
This Supermicro SNK-P0067PSMB is a new 1U passive proprietary middle-air-channel heat sink built for Intel Xeon Scalable processors using the narrow LGA 3647-0 mounting mechanism. It is designed for system integrators and IT teams deploying or maintaining Supermicro X11 Purley platform servers in rack environments.
The cooler fits a single 1U chassis slot and relies on forced chassis airflow through its middle air channel to dissipate heat from supported CPUs. It handles thermal loads typical of compatible Xeon Scalable parts within the platform specification; higher-TDP processors or enclosures with restricted airflow will exceed its passive cooling capability.
Supermicro certification confirms the heat sink meets the vendor’s mechanical and thermal validation for the X11 Purley platform, ensuring correct mounting pressure and alignment with the narrow socket retention system. Using a non-certified alternative risks improper contact, clearance conflicts or insufficient cooling under sustained server workloads.
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| Size & build | |
|---|---|
| Shipping weight | 0.91 kg |
| Package size | 102 × 102 × 51 mm |
Yes, it is designed for the LGA 3647-0 narrow mounting mechanism used on Supermicro X11 Purley platform boards.
Verify the mounting mechanism locks firmly onto the socket retention frame and that the middle air channel aligns with the processor surface.
The accessory is the passive 1U heat sink only; thermal interface material and any required backplate are supplied separately.
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