Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 mm 2 pcs
- 8.0 W/mK
- -100 °C to 250 °C
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Silicone thermal pad rated at 8.0 W/mK, sized 120 × 20 × 1.5 mm, electrically insulating and compressible for filling gaps between heatsinks and components
Model 20 x 120 x 1.5 mm
This thermal pad is designed for PC builders and console owners who need to bridge uneven gaps between a heat source and a heatsink where thermal paste cannot be applied. It suits laptops, desktops, and PlayStation or Xbox consoles requiring reliable heat transfer across irregular surfaces.
The pad delivers 8.0 W/mK thermal conductivity at a thickness of 1.5 mm, making conductivity and thickness the decisive figures for matching your specific gap tolerance. It operates continuously from -100 °C to +250 °C and carries a V-0 flammability rating with electrical insulation rated at 8 kV/mm.
The self-adhesive, Shore 00-60 silicone sheet is soft enough to conform with only light pressure, yet it can be trimmed to fit smaller components such as VRM arrays or memory modules. Because the material is compliant, over-tightening mounting screws may compress it beyond its optimal range, so secure the heatsink just enough to hold contact without excessive force.
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| Product | |
|---|---|
| Brand name | Thermal Grizzly |
| Product line | Minus Pad 8 |
| Model name | TG-MP8-120-20-15 1R |
| Part number | TG-MP8-120-20-15-1R |
| Performance | |
| Thermal conductivity | 8.0 W/mK |
| Environment & compliance | |
| Continuous-use temperature | -100 °C to 250 °C |
Other versions of this model
The 8.0 W/mK conductivity lets the pad transfer heat efficiently across the 120 × 20 mm area at 1.5 mm thickness, filling gaps between a chip and heatsink in laptops, PS5, Xbox Series X or MacBooks.
Shore 00-60 makes the pink silicone very soft and highly compressible, so light pressure creates full surface contact and conforms to uneven substrates without damaging delicate components.
The pad measures 120 mm long, 20 mm wide and 1.5 mm thick; it can be cut to smaller pieces for VRAM chips, VRM rows or an M.2 heatsink while keeping the same thermal performance.
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