Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 × 1.5 mm
- 8.0 W/mK
- -100 °C to 250 °C
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High-conductivity 8.0 W/mK silicone pad fills gaps between heatsinks and chips in PCs or consoles
Model 20 x 120 x 0.5 mm - 2 pcs
Thermal Grizzly Minus Pad 8 is a modified silicone thermal pad filled with metal oxides. It provides 8.0 W/mK thermal conductivity for transferring heat between a component and its heatsink. The pad remains flexible across a long-term operating range of -100 °C to +250 °C. Two pieces are supplied for multiple applications.
This pad suits desktop PC, laptop and console owners who need a conformable interface for uneven surfaces or wide gaps where thermal paste would not bridge. It is not suited for buyers who require a liquid compound for microscopic contact or those needing a specific thickness not offered here.
The single specification that determines suitability is the 8.0 W/mK thermal conductivity rating. Match this value to the thermal resistance budget of your assembly to confirm the pad will dissipate enough heat for the target component.
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| Product | |
|---|---|
| Brand name | Thermal Grizzly |
| Product line | Minus Pad 8 |
| Model name | TG-MP8-120-20-05 2R |
| Part number | TG-MP8-120-20-05-2R |
| Performance | |
| Thermal conductivity | 8.0 W/mK |
| Environment & compliance | |
| Continuous-use temperature | -100 °C to 250 °C |
Other versions of this model
Each pad measures 120 mm by 20 mm, giving a thin rectangular sheet that fits tight gaps around VRMs, memory modules or console APUs.
Peel the protective liner from one face, press the exposed adhesive onto the component, then remove the second liner before seating the heatsink; either orientation works because both sides conduct equally.
The pad is rated for continuous operation from -100 °C to +250 °C and does not dry out like paste, so plan on swapping it only when you disassemble the heatsink for a major upgrade or cleaning.
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