Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 × 1.5 mm
- 8.0 W/mK
- -100 °C to 250 °C
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Silicone thermal pad measuring 120 × 20 × 3.0 mm with 8.0 W/mK conductivity, self-adhesive and electrically insulating for CPUs, GPUs and consoles
Model 20 x 120 x 3.0 mm
The Thermal Grizzly Minus Pad 8 is a pink silicone thermal interface measuring 120 by 20 millimetres with a 3.0 millimetre thickness. It delivers 8.0 W/mK conductivity and suits computers, laptops, PS3, PS4, PS5, Xbox 360, One and Series X systems. The material is electrically insulating to 8 kV per millimetre and rated V-0 for flammability.
The pad compresses to a Shore 00-60 softness, filling large air gaps or uneven substrates where thermal paste cannot be used. It adheres with a light touch and operates continuously from minus 100 °C to plus 250 °C. The ceramic silicone and nano aluminium oxide construction maintains constant heat transfer without drying out.
Builders replacing 5 W/mK or 6 W/mK pads gain measurable thermal headroom for sustained loads. The jump is worth it when stock pads throttle VRAM, VRM or console APUs under prolonged gaming. Buyers needing thicknesses below 3.0 millimetres or smaller footprints should select a different size from the series.
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| Product | |
|---|---|
| Brand name | Thermal Grizzly |
| Product line | Minus Pad 8 |
| Model name | TG-MP8-120-20-30 1R |
| Part number | TG-MP8-120-20-30-1R |
| Performance | |
| Thermal conductivity | 8.0 W/mK |
| Environment & compliance | |
| Continuous-use temperature | -100 °C to 250 °C |
Other versions of this model
The pad is rated for continuous operation from -100 °C to +250 °C, so its 8.0 W/mK conductivity remains stable under sustained loads
The pad itself generates no noise or heat; it passively transfers heat away from the component within its -100 °C to +250 °C operating range
You need a heatsink or metal surface to press against the pad, plus a clean, flat mounting area that matches the 120 × 20 mm dimensions
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