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Removes solder with 2.0 mm copper braid, 1.5 m length, suited for Sn60 and Sn63 alloys
This 2.0 mm copper desoldering braid removes excess solder from circuit boards and component leads. The spool holds 1.5 metres of flux-coated wick, supplied as a single CP-2015 unit. It is intended for technicians and hobbyists who need to clean joints during repair or rework.
The 2.0 mm width fits standard through-hole pins and wider SMT pads, absorbing molten solder when heated with an iron. It is less suitable for very fine-pitch IC legs or dense BGA arrays where a narrower braid would be required. Users working exclusively on micro-scale boards should consider a smaller width.
The braid measures 2.0 mm wide, which dictates the maximum contact area it can cover in a single pass. This dimension decides whether the wick can draw solder from the target joints without bridging adjacent pins. The 150 cm length provides multiple uses before replacement.
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| Product | |
|---|---|
| Product type | 2.0MM Desoldering Copper Braid Solder Remover Spool Flux Wick Wire Cable |
| Size & build | |
| Size or dimensions | 2.0MM |
| Main material | 2.0MM |
Place the braid over the joint, press the hot iron tip onto it until the solder is absorbed, then lift both together; the step many miss is cutting off the used section with nippers before the next joint.
The braid is single-use; once a section is saturated with solder it must be snipped off and discarded, so you simply pull fresh length from the 1.5 m spool as needed.
Absorbability drops when the flux is spent or when the solder alloy differs; the supplier notes Sn 63 % and 60 % tin solders absorb well, while other alloys may saturate the braid faster.
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