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Four small square copper heatsinks with adhesive tape backing

EN-Labs

EN-Labs Copper Heatsink 15x15x2mm 2.0 W/mK Pack of 4

SKU CH-0YNK-SHJ4J

Pack of four 15×15×2 mm copper heatsinks with 2.0 W/mK thermal tape for motherboard, GPU, DDR2, DDR3 RAM and chipset cooling

  • Pure copper conducts heat at 401 W/mK
  • 0 W/mK adhesive tape simplifies installation
  • 15x15x2mm size fits motherboard, GPU and RAM chips
  • Pack of four covers multiple components
  • Compatible with DDR2 and DDR3 memory modules

Copper heatsinks for IC and memory cooling

Four 15 mm square copper shims with pre-applied 2.0 W/mK thermal adhesive tape arrive ready to install on motherboard chipsets, GPU memory or DDR2 and DDR3 modules. The pure copper construction conducts heat at up to 401 W/mK, far above aluminium alternatives. Each shim measures 15x15x2 mm and adds minimal height inside tight enclosures.

Sustained heat spreading across small components

The adhesive tape bonds directly to IC surfaces, eliminating air gaps that degrade contact over time. Copper’s high bulk conductivity moves heat laterally across the 15 mm face, reducing local hotspots during long gaming or compute sessions. Thermal resistance stays stable because the tape does not pump out or dry like some pastes.

Low-profile build with no mechanical fasteners

Solid copper resists corrosion and retains flatness after repeated heating cycles. The 2 mm thickness clears most low-profile RAM heatsinks and laptop BGA packages without fouling adjacent components. Tape mounting removes the need for clips or screws, simplifying upgrades on Xbox 360, PlayStation 2, 3, 4 and PC boards alike.

How it compares

Measured against everything we stock in Heatsinks & Water Blocks, at today’s prices. Recalculated every night.

Price $6.99
Cheaper than about 90% of the 609 comparable items (median $15.99).

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Specifications

No published specifications for this item yet.

Questions about this item

Does the 2.0 W/mK thermal tape add noticeable heat once the heatsink runs continuously?

The tape conducts at 2.0 W/mK and the copper body at 401 W/mK, so heat moves away from the chip rather than building up in the adhesive layer.

What must I already have to attach these 15×15×2 mm shims to a chip?

Clean the chip surface, peel the supplied tape, press the heatsink in place — no screws, brackets or extra thermal compound are required.

Will these fit the DDR2 and DDR3 memory modules I still use?

The 15 mm square footprint matches standard DDR2 and DDR3 chip packages, and the 2 mm height clears typical board components.

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