ENERMAX ESC001-BK M.2 2280 NVMe SSD Heatsink DIY Cooling
- Material: Aluminum,…
- SSD Heatsink
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Eight copper heatsinks with 2.0 W/mK adhesive tape cool motherboard, GPU, DDR2, DDR3 RAM and chipset components
Eight solid copper shims measuring 8x8x4mm arrive with pre-applied thermal adhesive tape rated at 2.0 W/mK. They target motherboard chipsets, graphics memory and legacy console processors such as Xbox 360 and PlayStation 2, 3 and 4. The copper construction delivers up to 401 W/mK bulk conductivity for small hot-spots.
Each heatsink uses a silicone-based adhesive strip that bonds directly to IC packages without screws or clips. Installation is limited to cleaning the surface, peeling the liner and pressing firmly. The tape thickness adds .16 inch to the stack height, so very tight clearances around tall components may prevent fitment.
The pack covers up to eight individual memory or logic chips, suitable for DDR2 and DDR3 modules or southbridge cooling. Thermal headroom is constrained by the 2.0 W/mK interface and the 4mm fin height; sustained high-wattage loads on large GPUs or multi-core CPUs will exceed the dissipation area.
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Monitor component temperatures with system software; a drop in reported values for the CPU, GPU, VRAM or chipset indicates the copper shims and 2.0 W/mK adhesive tape are transferring heat as intended.
The pack contains eight 8x8x4mm solid copper heatsinks with pre-applied 2.0 W/mK thermal adhesive tape; no extra thermal material or tools are required.
The heatsinks are compatible with all standard SD, DDR, DDR2 and DDR3 SDRAM, so a single pack covers both memory types.
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