ENERMAX ESC001-BK M.2 2280 NVMe SSD Heatsink DIY Cooling
- Material: Aluminum,…
- SSD Heatsink
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Ten black anodised aluminium heatsinks with thermal adhesive for Raspberry Pi B+, Pi 2 and Pi 3 CPU and LAN chips
This kit supplies ten anodised black aluminium heatsinks designed for Raspberry Pi B+, Pi 2 and Pi 3 boards. Each set includes one 14mm CPU heatsink and one 8.8mm LAN heatsink, giving five complete kits per pack. The parts use a peel-and-stick thermal adhesive layer for tool-free installation on the corresponding chip modules. They are aimed at hobbyists and embedded developers who need passive cooling for these specific single-board computers.
The pre-applied thermal adhesive creates a permanent bond once pressed onto clean, grease-free chip surfaces. Repositioning after firm pressure is not practical, so alignment must be correct on the first attempt. The adhesive thickness is fixed and cannot be replaced with a different thermal interface material. Builders who require removable or reusable cooling solutions should consider clip-on or screw-mounted alternatives instead.
The CPU heatsink measures 14mm wide by 7.5mm tall, while the LAN heatsink measures 8.8mm wide by 5mm tall. These dimensions determine whether the assembled board will fit inside a chosen enclosure or stack with HATs and other add-on boards. Buyers who need lower-profile cooling for slim cases or tight vertical clearances must verify these heights against their mechanical constraints before purchasing.
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| Product | |
|---|---|
| Product color | Black |
| Size & build | |
| Main material | Aluminium |
| Product dimensions | 1x 14mmx14mmx7.5 mm CPU chipset 1x 8.8mmx8.8mmx5 mm LAN chipset |
| Compatibility | |
| Compatible with | Motherboard Chipsets |
Each kit contains one 14mm x 14mm x 7.5mm heatsink for the CPU and one 8.8mm x 8.8mm x 5mm heatsink for the LAN chip, so a single kit covers both components.
The CPU heatsink stands 7.5mm tall and the LAN heatsink 5mm tall, adding minimal clearance above the chips while still providing a solid aluminium surface for heat dissipation.
The pre‑applied adhesive layer lets you peel and stick the heatsinks directly onto clean chip surfaces, giving a secure bond without tools or mounting hardware.
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