NEMIX RAM 16GB (2x8GB) DDR5 5600 CL46 1.1V UDIMM memory upgrade for Supermicro X13SAE
- 16 GB (2 × 8 GB)
- 288-Pin DDR5 UDIMM
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32 GB DDR5 kit with two 16 GB modules running at 5600 MT/s, CL46, 1.1 V for the NZXT N7 B850 motherboard
This 32 GB kit contains two 16 GB DDR5 5600 UDIMMs built to the NZXT N7 B850 motherboard's native specifications. It uses the 288-pin unbuffered non-ECC form factor and 1Rx8 rank organisation that the board expects, so the memory controller recognises the full capacity at rated speed.
Operating at 1.1 V with CL46 timing, the modules run at standard DDR5 voltage without a heat spreader. Power draw stays within the JEDEC baseline for 5600 MT/s UDIMMs, and the bare PCB design produces no additional acoustic load beyond the system's existing airflow.
The kit replaces lower-capacity or slower DDR5 modules when the NZXT N7 B850 platform needs 32 GB at its supported 5600 MT/s rate. It is not for systems that require ECC, registered DIMMs, or a different DDR generation, and it does not suit boards limited to lower maximum densities or speeds.
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| Product | |
|---|---|
| Brand name | NEMIX RAM |
| Product line | NEMIX RAM Original Series Memory |
| Model name | DDR5 Non-ECC Unbuffered UDIMM Memory |
| Part number | MD44800-618K2 |
| Total capacity | 32 GB (2 × 16 GB) |
| Product type | 288-Pin DDR5 UDIMM |
| Performance | |
| Rated speed | DDR5 5600 (PC5 44800) |
| Processor | |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Memory | |
| CAS latency | CL46 |
| ECC support | No |
| Buffer type | Unbuffered |
| Memory rank | 1Rx8 |
| Heat spreader | No |
| Power | |
| Rated voltage | 1.1 V |
| Compatibility | |
| Compatible systems | NZXT |
| In the box | |
| Included items | 32 GB 2 × 16 GB DDR5 5600 MHz PC5-44800 1Rx8 1.1 V 288-PIN Non-ECC UDIMM KIT |
Other versions of this model
Insert the first module into the DIMM slot the manual labels primary for single-channel boot, then add the second in the matching channel slot; the board will not train at 5600 MT/s if the population order is wrong.
No scheduled maintenance is required; the modules have no heat spreader, so keep case airflow clear of dust to maintain the 1.1V operating temperature envelope.
The CL46 latency at 5600 MT/s is the first bottleneck; bandwidth scales with the data rate, but the 46-cycle delay caps random-access throughput before thermal throttling can occur.
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