ENERMAX ESC001-BK M.2 2280 NVMe SSD Heatsink DIY Cooling
- Material: Aluminum,…
- SSD Heatsink
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Pack of ten 15×15 mm copper shims, 0.5 mm thick, rated at 401 W/mK for laptop CPU and GPU gap filling
This pack contains ten copper shims measuring 15mm by 15mm with a 0.5mm thickness. They are designed to transfer heat from BGA CPUs, GPU chips and memory ICs inside laptops. The copper material offers a thermal conductivity rating of 401 W/mK. Each shim replaces aged thermal pads that have lost effectiveness.
Measure the gap between the die and the heatsink contact plate to confirm a 0.5mm shim fills the space without excessive pressure. Verify that the 15mm square footprint covers the target component without overlapping neighbouring parts. Ensure the mounting mechanism can accommodate the added rigid layer.
The shim sits directly on the chip surface and conducts heat to the existing cooler assembly. It eliminates the need for thick thermal pads that degrade over time. The rigid copper layer maintains consistent contact pressure across the die. Ten pieces allow multiple chip coverage or spare units for future maintenance.
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| Size & build | |
|---|---|
| Main material | Copper |
| Product dimensions | 15 mm × 15 mm × 0.5 mm |
| Compatibility | |
| Compatible with | CPU |
The pack contains ten 15 mm × 15 mm copper shims at 0.5 mm thickness; thermal paste or pads are not included and must be purchased separately.
The shims measure 0.5 mm thick; the 0.6 mm figure appears only in the supplier title, so use the 0.5 mm specification when planning your stack height.
It indicates the copper shim conducts heat far better than standard copper (20–30 W/m·K), helping spread heat from BGA chips to the heatsink more efficiently.
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