EN-Labs Copper Heatsinks 7x7x5mm 2.0 W/mK Tape Pack of 8

Copper shims for chip cooling

Eight copper heatsinks measuring 7x7x5 mm arrive with pre-applied thermal adhesive tape rated at 2.0 W/mK. The shims target motherboard chipsets, graphics memory and DDR2 or DDR3 modules that run hotter than the board's stock airflow can handle. Pure copper construction gives a bulk conductivity of 401 W/mK, far above aluminium alternatives. Enthusiasts repairing consoles such as Xbox 360 or PlayStation 2 through 4 also use these for BGA packages.

Steady-state heat spreading

The adhesive tape bonds directly to the component surface, eliminating the air gaps that degrade pad performance over time. Under continuous load the copper body draws heat laterally across its 7 mm footprint before releasing it into the case airflow. Because the tape remains tacky through repeated thermal cycles, contact resistance stays low during extended gaming or compute sessions. No mechanical clips or screws are required, so vibration does not loosen the interface.

Adhesive thermal conductivity

The single figure that determines suitability is the tape's 2.0 W/mK rating; it governs how efficiently heat crosses from die to copper. If the target component generates more heat than this path can transport, temperatures will climb regardless of the copper's 401 W/mK bulk value. Buyers needing higher interface conductivity or larger footprints for voltage-regulator arrays should look elsewhere.